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Electromagnetic Heating Blog Posts

Video Lecture Series: Modeling Electromagnetic Coils in COMSOL®

July 16, 2020

Get an overview of our video lecture series on modeling coils using COMSOL Multiphysics and the AC/DC Module, from setting up a coil model to analyzing electromagnetic heating and more.

Modeling Cables in COMSOL Multiphysics®: 8-Part Tutorial Series

July 8, 2020

Your roadmap to modeling cables with the AC/DC Module and COMSOL Multiphysics®: An 8-part tutorial series that starts with the basics and gradually adds complexity and multiple physics.

Modeling Heat Transfer in Thin Layers via Layered Material Technology

May 15, 2020

We answer some questions you may have about the Layered Material functionality in the COMSOL® software: What does it do? How do you update existing models? How do simulations benefit from it?

Developing a Silicon MEMS Chip for On-Demand DNA Synthesis

January 21, 2020

The development of genome editing tools like CRISPR-Cas9 has increased the demand for DNA synthesis technology. Researchers are creating a DNA synthesis platform to broaden horizons in the field.

Which Study Type Should I Use for My Electrothermal Analysis?

January 13, 2020

What’s the best interface to use when implementing electrothermal analyses in COMSOL Multiphysics? We go over the interfaces, study types, and multiphysics couplings for high and low frequencies.

Optimizing Microwave Ovens with Solid-State RF Cooking

November 13, 2019

Did you know that conventional microwave ovens use the same magnetron technology that was first used in WWII? These researchers thought it was time for an upgrade…

10 Real Uses of COMSOL Multiphysics® in the Power Industry

October 16, 2019

Minimizing transformer noise, planning underground cable networks, and managing a power grid. Keep reading for more real-world examples in which simulation is used in the power industry.

Performing a Multiphysics Analysis of a Thermal Microactuator

March 8, 2019

To design an optimized thermal microactuator for use in a specific device, you need to account for tightly coupled electrical, thermal, and structural phenomena in your analysis.


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