Boundary condition for material layering in IGBT module to analyse thermal stress

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Hi, I am making a model of an IGBT module. Currently I have used the Heat transfer in solids, but I want to add thermal stress, which automatically adds Solid mechanics interface. Here the default boudary is "free", but I am unsure wheter or not I have to change this to something else in between the layers. Does COMSOL automatically account for the stress between two types of different materials?



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