Optimization of a Porous Microchannel Heat Sink
Application ID: 76191
This example computes the effectiveness of a porous microchannel heat sink over a conventional microchannel heat sink. The model is fully parameterized. A parameter study on the thickness of the porous substrate is used to determine the optimal configuration.
This model example illustrates applications of this type that would nominally be built using the following products:
however, additional products may be required to completely define and model it. Furthermore, this example may also be defined and modeled using components from the following product combinations:
- COMSOL Multiphysics® and
- CFD Module, Chemical Reaction Engineering Module, Heat Transfer Module, Plasma Module, or Porous Media Flow Module and
- CFD Module, Chemical Reaction Engineering Module, Corrosion Module, Electrochemistry Module, Electrodeposition Module, Heat Transfer Module, Porous Media Flow Module, or Subsurface Flow Module and
- CFD Module, Chemical Reaction Engineering Module, Corrosion Module, Electrochemistry Module, Electrodeposition Module, Microfluidics Module, Porous Media Flow Module, or Subsurface Flow Module
The combination of COMSOL® products required to model your application depends on several factors and may include boundary conditions, material properties, physics interfaces, and part libraries. Particular functionality may be common to several products. To determine the right combination of products for your modeling needs, review the Tabela de Especificações and make use of a free evaluation license. The COMSOL Sales and Support teams are available for answering any questions you may have regarding this.