See How Multiphysics Simulation Is Used in Research and Development
Engineers, researchers, and scientists across industries use multiphysics simulation to research and develop innovative product designs and processes. Find inspiration in technical papers and presentations they have presented at the COMSOL Conference. Browse the selection below or use the Quick Search tool to find a specific presentation or filter by application area.
View the COMSOL Conference 2023 Collection
The Role of 1D & 2D Asymmetric Diffusion Layers In Rectification Through Ion-Selective Membranes
Ion-selective membranes can be used in lab-on-a-chip devices for various portable applications in this field. These devices can be used as concentrators for analytical chemistry and for micro-scale filtration. Here, a binary aqueous electrolyte solution in a microchannel has a potential ... Read More
Numerical Analysis of the 3-omega-method
Determining the thermal conductivity of condensed matter attracted much attention in past years. While several techniques exist to measure the thermal conductivity of solids or thin films, the 3-omega-method is one of the most well-established due to its high accuracy. First, COMSOL ... Read More
Validation of Negative Ion Beam Space Charge Compensation
The transport of intense ion beams with reduced beam divergence over reasonable drift distances requires a reliable space charge compensation (SCC). Negative ion beams (required in the Neutral Beam Injectors envisioned for the ITER tokamak) are here discussed. Secondary particles are ... Read More
Radiofrequency Inductive Coupled Plasmas Towards Low Pressure
Inductively coupled plasmas (ICP) are largely used as a convenient way to produce large ion currents in industrial applications and for particle accelerators and for the Neutral Beam Injectors (NBI) envisioned for tokamak heating (ITER project and beyond). Among specifications we have ... Read More
Study on the Holding Characterestics of a Magnetic Gripper
Magnetic grippers are commonly used for workholding in handling and assembly of ferrous metalcasted parts. The workholding force produced by the magnetic gripper is strongly influenced by the texture and form of the workpiece in contact with its surface. This work explores the optimal ... Read More
Using the Superposition Principle and Edge Current Model to Compute Impedance of the Coil in a Logging Tool
Coil antenna is the simplest form in well-logging tools for resistivity measurement of the formation. This paper introduces how to accurately compute the impedance of the coil with very thin wires at high frequency, and with the complex borehole structure, e.g., metal housing and ... Read More
Modeling of Susceptor Assisted Microwave Heating in Domestic Ovens
Susceptors are very thin metallic microwave absorbing films used in microwaveable food packaging. They tend to heat up very rapidly during microwave heating and this effect helps to overcome two major issues faced in domestic microwave ovens; 1) Non-uniform heating and 2) lack of ... Read More
Polymer Compositional Profile Controls By-Product Fate from Erodible Endovascular Scaffolds
Erodible polymeric scaffolds can mitigate long-term risks associated with permanent implants currently used to treat ischemic artery disease. However, safe deployment of erodible scaffolds is predicated on understanding the interactions between evolved material by-products and local ... Read More
Optimization of a High-Temperature High-Pressure Direct Wafer Bonding Process for III-V Semiconductors
Many optoelectronic devices utilize a heterojunction of a pair semiconducting materials including high-efficiency MEMS devices, solar cells, LEDs, and VCSELs. One fabrication technique which achieves such a device is direct wafer fusion. To optimize the process, COMSOL Multiphysics 4 ... Read More
Modeling and Simulation of Artificial Core-Shell Based Nanodielectrics for Electrostatic Capacitors Applications
The need for high storage capacitors led to the development of polymer based capacitors. Polymers have high processability, mechanical flexibility, electrical breakdown strength and compatibility with printed circuit board (PCB) technologies; but usually have very low permittivity (K). ... Read More